JPH02129731U - - Google Patents
Info
- Publication number
- JPH02129731U JPH02129731U JP3808689U JP3808689U JPH02129731U JP H02129731 U JPH02129731 U JP H02129731U JP 3808689 U JP3808689 U JP 3808689U JP 3808689 U JP3808689 U JP 3808689U JP H02129731 U JPH02129731 U JP H02129731U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thin film
- heat equalizing
- equalizing member
- holding frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3808689U JPH02129731U (en]) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3808689U JPH02129731U (en]) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129731U true JPH02129731U (en]) | 1990-10-25 |
Family
ID=31545778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3808689U Pending JPH02129731U (en]) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129731U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502538A (ja) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | 高圧処理中にウエハを保持する真空チャック装置及び方法 |
-
1989
- 1989-03-31 JP JP3808689U patent/JPH02129731U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502538A (ja) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | 高圧処理中にウエハを保持する真空チャック装置及び方法 |
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